Paste Additive

BrandSSRL

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• Riding on unfathomable volumes of industrial expertise, we are engaged in offering a broad assortment of Paste Additive.

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  • Time Consuming Procedure can convert into non-curing process could reduce production time and costs. The metallic lead content has to be reduced to below 2 wt.% or less after the curing process 
  • A higher content of free lead may result in swelling, warping and/or extensive sludge formation during the formation of positive plates
  • Main Benefit of SSCFP – Curing Free Paste Additive paste must be subjected to curing and drying processes during which temperature and humidity have to be carefully controlled.
  • These processes are time consuming require considerable space and energy,and hence increase product cost.
  • Furthermore, the resulting plates are rather rigid and stiff, which makes them suitable
  • By use of SSCFP, a paste has excellent adhesion to the grids of a battery plate
  • Directions for Use: For Curing Free Paste preparation Take 100 kg.of Blend Say 60:20 Ratio of Grey Oxide & Red Lead. Take 16 Lit SSCFP – Curing Free Paste Additive Solution and add slowly slowly into paste mixer up to 20 to 25 minutes.
  • Paste temperature will go high upto 80 deg celsius.
  • Then start Fan cooling to paste and add water to decrease temperature,( 4 BS Structure will generate in this step)After that Only Air Dry plates – Direct Group Assembly – Charging – Discharging – Ready
  • Storage: Carboys of SSCFP must be stored in cool, shaded god owns free from dusty atmosphere and away from light and heat
  • Persons handling this material must take the usual precautions of wearing goggles, rubber gloves and shoes
  • Packing: 35 kg Carbo drum

  Minimum Order Quantity1

  Accept Small Orders Yes

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